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Results: 1-8 |
Results: 8
Determination of resist exposure parameters in helium ion beam lithography: Absorbed energy gradient, contrast, and critical dose
Authors: Ruchhoeft, P Wolfe, JC
Citation: P. Ruchhoeft et Jc. Wolfe, Determination of resist exposure parameters in helium ion beam lithography: Absorbed energy gradient, contrast, and critical dose, J VAC SCI B, 18(6), 2000, pp. 3177-3180
Optimal strategy for controlling linewidth on spherical focal surface arrays
Authors: Ruchhoeft, P Wolfe, JC
Citation: P. Ruchhoeft et Jc. Wolfe, Optimal strategy for controlling linewidth on spherical focal surface arrays, J VAC SCI B, 18(6), 2000, pp. 3185-3189
Experimental evaluation of an optimized radiation cooling geometry for ionprojection lithography masks
Authors: Torres, JL Nounu, HN Wasson, JR Wolfe, JC Lutz, J Haugeneder, E Loschner, H Stengl, G Kaesmaier, R
Citation: Jl. Torres et al., Experimental evaluation of an optimized radiation cooling geometry for ionprojection lithography masks, J VAC SCI B, 18(6), 2000, pp. 3207-3209
Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by step and flash imprint lithography
Authors: Ruchhoeft, P Colburn, M Choi, B Nounu, H Johnson, S Bailey, T Damle, S Stewart, M Ekerdt, J Sreenivasan, SV Wolfe, JC Willson, CG
Citation: P. Ruchhoeft et al., Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by step and flash imprint lithography, J VAC SCI B, 17(6), 1999, pp. 2965-2969
Ion projection lithography: International development program
Authors: Kaesmaier, R Loschner, H Stengl, G Wolfe, JC Ruchhoeft, P
Citation: R. Kaesmaier et al., Ion projection lithography: International development program, J VAC SCI B, 17(6), 1999, pp. 3091-3097
Directly sputtered stress-compensated carbon protective layer for silicon stencil masks
Authors: Hudek, P Hrkut, P Drzik, M Kostic, I Belov, M Torres, J Wasson, J Wolfe, JC Degen, A Rangelow, IW Voigt, J Butschke, J Letzkus, F Springer, R Ehrmann, A Kaesmaier, R Kragler, K Mathuni, J Haugeneder, E Loschner, H
Citation: P. Hudek et al., Directly sputtered stress-compensated carbon protective layer for silicon stencil masks, J VAC SCI B, 17(6), 1999, pp. 3127-3131
Circularly polarized 20-GHz high-temperature superconducting microstrip antenna array
Authors: Morrow, JD Williams, JT Davis, MF Licon, DL Rampersad, HR Jazdyk, DR Zhang, XP Long, SA Wolfe, JC
Citation: Jd. Morrow et al., Circularly polarized 20-GHz high-temperature superconducting microstrip antenna array, IEEE APPL S, 9(4), 1999, pp. 4725-4732
Fabrication of silicon stencil masks with vitreous carbon ion-absorbing coatings
Authors: Ruchhoeft, P Wolfe, JC Wasson, J Torres, J Wu, H Nounu, H Liu, N Herbordt, M Morgan, MD Tiberio, RC
Citation: P. Ruchhoeft et al., Fabrication of silicon stencil masks with vitreous carbon ion-absorbing coatings, J VAC SCI B, 16(6), 1998, pp. 3599-3601
Risultati: 1-8 |