Authors:
ZABINSKI PJ
VICKBERG ME
GILBERT BK
ZUCARELLI PJ
WENINGER DV
KELLER TW
YEE DM
Citation: Pj. Zabinski et al., CASE-STUDY - THE DESIGN OF A MIXED-SIGNAL GLOBAL POSITIONING SYSTEM RECEIVER USING MULTICHIP-MODULE PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 215-224
Authors:
ZABINSKI PJ
GILBERT BK
ZUCARELLI PJ
WENINGER DV
KELLER TW
Citation: Pj. Zabinski et al., EXAMPLE OF A MIXED-SIGNAL GLOBAL POSITIONING SYSTEM (GPS) RECEIVER USING MCM-L PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 13-17
Authors:
HALLER TR
WHITMORE BS
ZABINSKI PJ
GILBERT BK
Citation: Tr. Haller et al., HIGH-FREQUENCY PERFORMANCE OF GE HIGH-DENSITY INTERCONNECT MODULES, IEEE transactions on components, hybrids, and manufacturing technology, 16(1), 1993, pp. 21-27