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Results: 1-25 | 26-50 | 51-75 | 76-76 |
Results: 76-76/76
RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill
Authors: Feng, ZP Zhang, WG Su, BZ Gupta, KC Lee, YC
Citation: Zp. Feng et al., RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill, IEEE MICR T, 46(12), 1998, pp. 2269-2275
Risultati: 1-25 | 26-50 | 51-75 | 76-76 |