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Citation: As. Zuruzi et al., Correlation between intermetallic thickness and roughness during solder reflow, J ELEC MAT, 30(8), 2001, pp. 997-1000

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Authors: Zuruzi, AS Li, H Dong, G

Citation: As. Zuruzi et al., Diffusion bonding of aluminium alloy 6061 in air using an interface treatment technique, MAT SCI E A, 259(1), 1999, pp. 145-148

Authors: Zuruzi, AS Chiu, CH Lahiri, SK Chua, KM

Citation: As. Zuruzi et al., Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions, J ELEC MAT, 28(11), 1999, pp. 1224-1230

Authors: Zuruzi, AS Chiu, CH Lahiri, SK Tu, KN

Citation: As. Zuruzi et al., Roughness evolution of Cu6Sn5 intermetallic during soldering, J APPL PHYS, 86(9), 1999, pp. 4916-4921

Authors: Zuruzi, AS Chiu, CH Chen, WT Lahiri, SK Tu, KN

Citation: As. Zuruzi et al., Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow, APPL PHYS L, 75(23), 1999, pp. 3635-3637