A highly sensitive solid-state imager has been made by connecting an a
valanche multiplier film to a MOS readout circuit through microbump el
ectrodes. Optimization of the vapor-deposition conditions for the indi
um bump material made it possible for microbumps 5 mu m in diameter an
d 5 mu m in height to be formed into a 2/3-in matrix array of 380 000
pixels. A prototype imager was constructed with a 0.5-mu m thick avala
nche photoconductive film. Clear avalanche multiplication of about ten
times was observed at an applied voltage of 75 V. The imager had a go
od resolution and no recognizable afterimages.