IMPROVING BREAKDOWN VOLTAGE OF SIC SI HETEROJUNCTION WITH GRADED STRUCTURE BY RAPID THERMAL CVD TECHNOLOGY/

Citation
Jd. Hwang et al., IMPROVING BREAKDOWN VOLTAGE OF SIC SI HETEROJUNCTION WITH GRADED STRUCTURE BY RAPID THERMAL CVD TECHNOLOGY/, I.E.E.E. transactions on electron devices, 44(11), 1997, pp. 2029-2031
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
44
Issue
11
Year of publication
1997
Pages
2029 - 2031
Database
ISI
SICI code
0018-9383(1997)44:11<2029:IBVOSS>2.0.ZU;2-N
Abstract
A novel graded process has been developed to improve the characteristi cs of SiC/Si heterojunction diode (HJD) by rapid thermal chemical vapo r deposition (RTCVD). The graded process was obtained by varying the f low of C3H8 gas from 0-10 seem with a ramp rate of 2 sccm/min. The dev eloped SiC/Si heterojunction diodes exhibit good rectifying properties , At forward bias, the built-in voltage of 0.63 V and excellent ideali ty factor n 1.28 were obtained by C-V and I-V measurements, respective ly, For reverse bias, the breakdown voltage more than 16 V with low le akage current density Is 3.74 x 10(-4) A/cm(2) at 16.2 V reverse bias, Additionally, the SEM and TEM cross section have been employed to evi dence that the graded method has a better SiC/Si interface than the co nventional carbonization process.