An experimental high performance 16 Mb Dynamic Random Access Memory (D
RAM) having a 0.18 mu m design rule for gigabit DRAM's was developed,
Junction leakage current and junction capacitance were reduced by shal
low trench isolation (STI), A fast access time even at low operation v
oltage (1.5 V) was achieved by TiSi2 gate and new circuit techniques,
Large sensing margin and stable operation were achieved by using a new
dielectric material (Ta2O5,) in the cell capacitor, Insufficient dept
h of focus margin for back-end of line process was overcome by triple
metallization scheme with one W and two Al metals, With these new tech
nologies, high speed of 28 ns row address access time (T-rac) at 1.5 V
and small chip size of 5.3 x 5.4 mm(2) were achieved.