ARE HIGH-RESOLUTION RESISTOMETRIC METHODS REALLY USEFUL FOR THE EARLYDETECTION OF ELECTROMIGRATION DAMAGE

In this paper the use of High Resolution Resistometric Techniques for early detection of electromigration strength of Al-Cu/TiN/Ti stripes i s analyzed. Two lots of 4 mu m wide lines were tested obtaining largel y different lifetimes. When comparing the early resistance changes, at a first sight a similar behaviour was detected in the two lots. Howev er, a more accurate inspection of the resistance evolution revealed th e presence of two distinct and subsequent stages. Significant differen ces were detected during the first stage only, lasting a few hours. If confirmed by extensive experiments, this result could open new perspe ctives for the early detection of the metal quality. (C) 1997 Elsevier Science Ltd.