A. Scorzoni et al., ARE HIGH-RESOLUTION RESISTOMETRIC METHODS REALLY USEFUL FOR THE EARLYDETECTION OF ELECTROMIGRATION DAMAGE, Microelectronics and reliability, 37(10-11), 1997, pp. 1479-1482
In this paper the use of High Resolution Resistometric Techniques for
early detection of electromigration strength of Al-Cu/TiN/Ti stripes i
s analyzed. Two lots of 4 mu m wide lines were tested obtaining largel
y different lifetimes. When comparing the early resistance changes, at
a first sight a similar behaviour was detected in the two lots. Howev
er, a more accurate inspection of the resistance evolution revealed th
e presence of two distinct and subsequent stages. Significant differen
ces were detected during the first stage only, lasting a few hours. If
confirmed by extensive experiments, this result could open new perspe
ctives for the early detection of the metal quality. (C) 1997 Elsevier
Science Ltd.