MMIC IN-CIRCUIT AND IN-DEVICE TESTING WITH AN ON-WAFER HIGH-FREQUENCYELECTRIC FORCE MICROSCOPE TEST SYSTEM

Citation
A. Leyk et al., MMIC IN-CIRCUIT AND IN-DEVICE TESTING WITH AN ON-WAFER HIGH-FREQUENCYELECTRIC FORCE MICROSCOPE TEST SYSTEM, Microelectronics and reliability, 37(10-11), 1997, pp. 1575-1578
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
00262714
Volume
37
Issue
10-11
Year of publication
1997
Pages
1575 - 1578
Database
ISI
SICI code
0026-2714(1997)37:10-11<1575:MIAITW>2.0.ZU;2-C
Abstract
In-circuit and in-device tests give valuable information for detailed function and failure analysis of monolithic microwave integrated circu its (MMIC), if simultaneously high spatial resolution, GHz signal meas urement ability and topographic imaging are achieved. Therefore a new high frequency electric force microscope was used to investigate the e lectrical behavior and function of devices and components within a 0-2 7 GHz traveling wave amplifier (TWA) by spatially resolved on wafer ma ppings of device internal voltages. Furthermore, comparisons between m easured and simulated data allow the internal localization of malfunct ion MMIC components, to give hints for a re-design. (C) 1997 Elsevier Science Ltd.