S. Dilhaire et al., HIGH-SENSITIVITY AND HIGH-RESOLUTION DIFFERENTIAL INTERFEROMETER - MICROMETRIC POLARISCOPE FOR THERMOMECHANICAL STUDIES IN MICROELECTRONICS, Microelectronics and reliability, 37(10-11), 1997, pp. 1587-1590
A high sensitivity and high resolution laser probe devoted to the ther
momechanical studies of microelectronic interconnects has been develop
ed. Surface displacements as low as 0.1 picometer (10(-13)m) can be ob
served, this allows the laser probe to investigate the edge effect in
interconnects. The stress field induced by the edge forces in the unde
rlying silicon dioxide layers has been observed. All measurements are
performed with a micrometric lateral resolution. (C) 1997 Elsevier Sci
ence Ltd.