SUBSTRATE-TO-BASE SOLDER JOINT RELIABILITY IN HIGH-POWER IGBT MODULES

Authors
HERR E FREY T SCHLEGEL R STUCK A ZEHRINGER R
Citation
E. Herr et al., SUBSTRATE-TO-BASE SOLDER JOINT RELIABILITY IN HIGH-POWER IGBT MODULES, Microelectronics and reliability, 37(10-11), 1997, pp. 1719-1722
Citations number
2
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
37
Issue
10-11
Year of publication
1997
Pages
1719 - 1722
Database
ISI
SICI code
0026-2714(1997)37:10-11<1719:SSJRIH>2.0.ZU;2-8
Abstract
Acoustic microscope imaging proved to be an excellent tool to detect a nd quantify solder fatigue of the substrate to base interface of high power IGBT modules. This technique was used to establish the dependenc e of the thermal cycling capability on the temperature swing of the mo dule base for a AlN/Cu system. Results from temperature cycling tests were combined with results from power cycling tests to predict the sol der joint reliability over a wide range of temperature excursions. (C) 1997 Elsevier Science Ltd.