DEVELOPMENT OF A SOLDER BUMP TECHNIQUE FOR CONTACTING A 3-DIMENSIONALMULTI ELECTRODE ARRAY

Authors
FRIESWIJK TA BIELEN JA RUTTEN WLC BERGVELD P
Citation
Ta. Frieswijk et al., DEVELOPMENT OF A SOLDER BUMP TECHNIQUE FOR CONTACTING A 3-DIMENSIONALMULTI ELECTRODE ARRAY, Microsystem technologies, 3(2), 1997, pp. 48-52
Citations number
16
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation
Journal title
Microsystem technologies → ACNP
ISSN journal
09467076
Volume
3
Issue
2
Year of publication
1997
Pages
48 - 52
Database
ISI
SICI code
0946-7076(1997)3:2<48:DOASBT>2.0.ZU;2-1
Abstract
The application of a solder bump technique for contacting a three-dime nsional multi electrode array is presented. Solder bumping (or C4: Con trolled Collapse Chip Connections, also called Flip Chip contacting) i s the most suitable contacting technique available for small dimension s and large numbers of connections. Techniques adapted from the litera ture could successfully be scaled down to be used for 55x55 mu m pads at 120 mu m heart-to-heart spacing, yielding well-conducting, reasonab ly strong bonds.