RELIABILITY ASSESSMENT FOR DEVELOPMENT OF MICROTECHNOLOGIES

In recent years, developments in the micro electronics industry have f ocused on semiconductors and semiconductor processes. However, microci rcuit assembly technologies have lagged chip development. This has spu rred research in interconnection and packaging creating many new techn ologies and enhancing integration. These new microelectronic technolog ies are enabling micro systems, and resulting in products, from portab le work stations to advanced automotive electronics. This evolution of technology has also created the need to reexamine how we achieve a re liable system. Clearly, in highly competitive marketplaces, reliabilit y is a key element in achieving successful products. To achieve a reli able product in a cost effective manner, ''upstream problem solving'' must be employed which focuses on root cause of failure. This paper pr ovides an overview of the reliability assessment process needed to ach ieve effective microsystem development. A case study of reliability in a complex multi-chip module is presented which includes an assessment of the stochastic nature of via fatigue by applying Monte Carlo simul ations.