Mj. Antonell et al., THERMAL-STABILITY OF HEAVILY TELLURIUM-DOPED INP GROWN BY METALORGANIC MOLECULAR-BEAM EPITAXY, Journal of electronic materials, 26(11), 1997, pp. 1283-1286
The thermal stability of tellurium in InP has been examined in samples
doped with Te up to an electron concentration of 1.4 x 10(20) cm(-3).
Annealing was conducted using rapid thermal annealing for a period of
one minute at temperatures over the range 650-800 degrees C. Secondar
y ion mass spectroscopy analysis showed virtually no change in the Te
profile before and after annealing, even at the highest annealing temp
eratures. High resolution x-ray diffraction and Hall measurements reve
aled a general decrease in the lattice strain and carrier concentratio
n for annealing temperatures above 650 degrees C. No evidence of strai
n relief was found in the form of cross-hatching or through the format
ion of a dislocation network as examined by scanning electronmicroscop
y or transmission electron microscopy (TEM). These results are most li
kely due to the formation of Te clusters, though such clusters could n
ot be seen by cross-sectional TEM.