ELECTRICAL-PROPERTIES OF METAL-INSULATOR-SEMICONDUCTOR STRUCTURES WITH SILICON-NITRIDE DIELECTRICS DEPOSITED BY LOW-TEMPERATURE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION DISTRIBUTED ELECTRON-CYCLOTRON-RESONANCE
Mc. Hugon et al., ELECTRICAL-PROPERTIES OF METAL-INSULATOR-SEMICONDUCTOR STRUCTURES WITH SILICON-NITRIDE DIELECTRICS DEPOSITED BY LOW-TEMPERATURE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION DISTRIBUTED ELECTRON-CYCLOTRON-RESONANCE, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(6), 1997, pp. 3143-3153
Citations number
47
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
The present article reports a study of current-voltage (J-E) and capac
itance-voltage (C-V) measurements on metal-insulator-semiconductor dio
des, using SiNx:H as an insulator layer and Si or InP as semiconductor
s. We have deposited SiNx:H films by distributed electron cyclotron re
sonance plasma enhanced chemical vapor deposition at floating temperat
ure, with physical properties similar to films prepared at 800 degrees
C by low pressure chemical vapor deposition. Silane and nitrogen were
used as the reactive gases. The experimental results show that the re
sistivity (rho) and the critical field (E-C) are a strong function of
the dielectric composition. For films deposited under optimum conditio
ns, rho was equal to 10(16) Ohm cm and E-C reached 3.65 or 4.5 MV/cm f
or Al/SiNx:H/Si and Al/SiNx:H/InP diodes, respectively. The dominant m
ode of electronic conduction appears to be the Poole-Frenkel emission.
The postmetallization annealing (PMA) has no significant effect on th
ese bulk properties (rho, E-C and electronic conduction). On the contr
ary, PMA has been shown to mainly affect the properties of both SiNx:H
/Si and SiNx:H/InP interfaces. The optimized Al/SiNx:H/Si fabrication
procedure induced a midgap interface state density (D-it) of 6 X 10(10
) eV(-1) cm(-2) evaluated by high frequency and quasistatic C-V charac
teristics. In the case of Al/SiNx:H/InP diodes, we have found that the
carrier trapping by direct tunneling near the SiNx:H/InP interface is
dominant. (C) 1997 American Vacuum Society. [S0734-2101(97)04406-0].