2ND-GENERATION LIQUID SOURCE MISTED CHEMICAL-DEPOSITION (LSMCD) TECHNOLOGY FOR FERROELECTRIC THIN-FILMS

This paper discusses the second generation liquid source misted chemic al deposition (LSMCD) technology currently being developed for ferroel ectric thin film deposition. A SubMicron Systems (SMS) Model Primaxx-2 F cluster tool was used to deposit the films. The developments that ha ve been made since the first generation machine are discussed. The pro cess chamber schematics along with the characteristics of the aerosol generator are explained in detail. The electrical properties obtained from the films deposited by the tool are found to be similar to that o f spin-on films. The step coverage obtained on patterned wafers are al so shown. The LSMCD technique combines the advantages of spin-on such as simplicity, good stoichiometry control and superior electrical prop erties with the advantages of CVD such as superior step coverage, manu facturability, etc.