Wm. Duncan et al., REAL-TIME DIAGNOSTICS OF II-VI MOLECULAR-BEAM EPITAXY BY SPECTRAL ELLIPSOMETRY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(2), 1997, pp. 216-222
Citations number
21
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Spectral ellipsometry has been applied to in situ diagnostics of Hg1-x
CdxTe molecular beam epitaxial growth. Spectral ellipsometry provides
surface, composition, and film thickness properties of thin film elect
ronic materials in real-time during growth and processing. This study
is discussed in two parts. In the first pact, the surface state proper
ties of Hg1-xCdxTe and the substrate material Cd1-xZnxTe were studied
under ultrahigh vacuum (UHV) conditions. By measuring the spectral ell
ipsometric quantities Psi and Delta versus temperature under UHV condi
tions, the presence and desorption temperatures of surface species hav
e been determined. Tellurium stabilized Cd1-xZnxTe surfaces were not o
bserved to exhibit any apparent surface changes during heating under t
hese conditions. Oxidized Cd1-xZnxTe surfaces, however, exhibit discon
tinuities in Psi and Delta indicative of desorption of a surface speci
es in the 300 degrees C range. Tellurium stabilized Hg1-xCdxTe surface
s also exhibit discontinuities in Psi and Delta occurring at about 177
degrees C. In the second part of the study, dielectric functions at t
he growth temperature, 180 degrees C, were determined for Hg1-xCdxTe a
lloys and Cd(0.96)Zn(0.04)4Te. Film compositions were monitored in sit
u and in real-time during Hg1-xCdxTe epitaxial growth based on this kn
owledge of growth temperature dielectric functions. An experimental an
alysis of measurement factors illustrates that compositional sensitivi
ty for in situ Hg1-xCdxTe measurement is limited by uncertainties in t
he angle and plane of incidence. Simulations show an ultimate multiwav
elength sensitivity of significantly better than +/-0.0008 is possible
for in situ composition measurements. (C) 1997 American Vacuum Societ
y.