TRANSMISSION ELECTRON-MICROSCOPY OF THE SEQUENCE OF PHASE-FORMATION IN THE INTERFACIAL SOLID-PHASE REACTIONS IN TA SI SYSTEMS/

Citation
A. Noya et al., TRANSMISSION ELECTRON-MICROSCOPY OF THE SEQUENCE OF PHASE-FORMATION IN THE INTERFACIAL SOLID-PHASE REACTIONS IN TA SI SYSTEMS/, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(2), 1997, pp. 253-257
Citations number
23
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
ISSN journal
07342101
Volume
15
Issue
2
Year of publication
1997
Pages
253 - 257
Database
ISI
SICI code
0734-2101(1997)15:2<253:TEOTSO>2.0.ZU;2-L
Abstract
The interfacial reaction of Ta thin films on (100) Si was, investigate d by high-resolution transmission electron microscopy. An amorphous la yer was observed at the as-deposited Ta/Si interface. A phase of Ta5Si 3 was first found to form at the interface between a Ta overlayer and the amorphous layer after annealing at 560 degrees C for 1 h. Annealin g at 630 degrees C for 1 h led to the formation of another interlayer due to the outdiffusion of Si between the amorphous layer and Si. The phase in this interlayer transformed from a metastable one to TaSi2 du e to annealing at 680 degrees C for 1 h. The first nucleation of Ta5Si 3 at the interface between Ta and the amorphous layer implies that the initially formed amorphous layer has a metal-rich composition close t o Ta5Si3. The formation of the interlayer between the amorphous layer and Si prior to the nucleation of TaSi2 was considered as a result of a kinetic constraint to favor the nucleation of TaSi2. (C) 1997 Americ an Vacuum Society.