LOCOS-induced stress effects on thin-film SOI devices are investigated
, We shaw that as the field oxide thickness increases, degradation (en
hancement) of nMOSFET's (pMOSFET's) I-V characteristics becomes increa
singly pronounced. The total degradation or enhancement of I-V charact
eristics can reach similar to 40% of drive current for devices under c
ertain processing condition, Estimated stress results using four-point
bending measurement show that the stress level on the silicon film is
of order 1200 MPa for devices with similar to 40% of I-V degradation/
enhancement. We attribute the stress phenomenon to the volumetric expa
nsion of held oxide during the LOCOS process.