HIGH-FIELD TRANSPORT OF INVERSION-LAYER ELECTRONS AND HOLES INCLUDINGVELOCITY OVERSHOOT

Citation
F. Assaderaghi et al., HIGH-FIELD TRANSPORT OF INVERSION-LAYER ELECTRONS AND HOLES INCLUDINGVELOCITY OVERSHOOT, I.E.E.E. transactions on electron devices, 44(4), 1997, pp. 664-671
Citations number
23
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
44
Issue
4
Year of publication
1997
Pages
664 - 671
Database
ISI
SICI code
0018-9383(1997)44:4<664:HTOIEA>2.0.ZU;2-L
Abstract
In this paper, we experimentally address the effect of a wide range of parameters on the high-held transport of inversion-layer electrons an d heres, The studied parameters include substrate doping level, surfac e micro-roughness, vertical field strength, nitridation of the gate ox ide, and device channel length. We employ special test structures buil t on Silicon-On-Insulator (SOI) and bulk wafers to accurately measure the high-held drift velocity of inversion-layer carriers, Our findings point to electron velocity overshoot at room temperature, dependence of electron and hole saturation velocities on nitridation of the gate oxide, dependence of the high-field drift velocity on the effective ve rtical held, and relative insensitivity of electron and hole mobility and saturation velocity to moderate surface roughness.