Realization of an easily manufacturable field emission device has been
widely recognized as one of the keys to the widespread acceptance of
vacuum microelectronics technology. Working to achieve this goal, many
researchers have investigated edge emission cathodes similar to those
developed by Gray et al. These efforts include work in the area of no
nplanar edge emission devices reported by Weichold et al. and devices
reported by Itoh et al. Based on that concept, this paper describes an
improved nonplanar edge emission diode, suitable for monolithic integ
ration. The structure described by Weichold has several interesting qu
alities, including the ability to easily define, nonphotolithographica
lly, the anode to cathode spacing during the fabrication process. Addi
tionally, the unique device geometry provides several advantages over
traditional structures. Unfortunately, this device does not lend itsel
f well to integration, due to the difficulty of making electrical cont
act to the cathode. An improved nonplanar diode design which addresses
this issue has been conceived and manufactured. The new design has th
e additional advantage of relying only upon standard manufacturing tec
hniques for its construction. Preliminary device testing has shown cur
rent-voltage characteristics that follow the Fowler-Nordheim model for
cold field emission over several orders of magnitude of current. In t
his work, various cathode sizes are investigated and several cathode a
rray sizes are tested.