This paper presents a new degraded drain current model for nMOSFETs wi
th hot-carrier-induced interface states. The model was developed by st
arting from a two-dimensional Poisson's equation and including the eff
ects of series resistances, carrier velocity saturation, and hot-carri
er-induced interface states. The nonuniform spatial distribution of in
terface states is also accounted for in the model. The fitting results
show good agreement between the model and the experimental data. The
model provides a physics-based approach for modeling forward and rever
se MOSFET characteristics with hot-carrier-induced damage and can be e
asily applied to simulation of device behavior after hot-carrier stres
s for assessment and improvement of long-term device or circuit reliab
ility.