A METHODOLOGY FOR LASER-BASED THERMAL-DIFFUSIVITY MEASUREMENT OF ADVANCED MULTICHIP-MODULE CERAMIC MATERIALS

Authors
KEHOE L KELLY PV OCONNOR GM OREILLY M CREAN GM
Citation
L. Kehoe et al., A METHODOLOGY FOR LASER-BASED THERMAL-DIFFUSIVITY MEASUREMENT OF ADVANCED MULTICHIP-MODULE CERAMIC MATERIALS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 773-780
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
18
Issue
4
Year of publication
1995
Pages
773 - 780
Database
ISI
SICI code
1070-9886(1995)18:4<773:AMFLTM>2.0.ZU;2-F
Abstract
Alumina derivative ceramics and low temperature co-fired ceramic (LTCC ) electronic multichip module (MCM) packaging substrates have been cha racterized using single- and double-sided inspection laser flash therm al diffusivity measurement techniques. The paper highlights problems a ssociated with both the measurement system and associated data analysi s for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) st andard laser flash method. Finally, a preliminary single-sided measure ment methodology is proposed.