EXPERIMENTAL INVESTIGATION OF SUBCOOLED LIQUID-NITROGEN IMPINGEMENT COOLING OF A SILICON CHIP

Authors
VADER DT CHRYSLER GM CHU RC SIMONS RE
Citation
Dt. Vader et al., EXPERIMENTAL INVESTIGATION OF SUBCOOLED LIQUID-NITROGEN IMPINGEMENT COOLING OF A SILICON CHIP, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 788-794
Citations number
11
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
18
Issue
4
Year of publication
1995
Pages
788 - 794
Database
ISI
SICI code
1070-9886(1995)18:4<788:EIOSLI>2.0.ZU;2-5
Abstract
A technique was developed to facilitate subcooled pool boiling and jet impingement boiling of liquid nitrogen at the surface of a silicon ch ip by varying the dewar pressure while maintaining the bath temperatur e constant at about 78 K. Subcooling levels of up to 10 K could be eas ily reached by pressurizing the liquid nitrogen bath with helium gas. Convective and boiling impingement cooling of up to 80 W/cm(2) from a silicon chip has been measured for a submerged subcooled liquid nitrog en jet.