R. Hild et al., THE CHALLENGES OF COLOR FOR WAFER INSPECTION FROM THE VIEWPOINT OF PARTIALLY COHERENT IMAGING THEORY, Microelectronic engineering, 26(3-4), 1995, pp. 195-215
The challenges and the possibilities of colour image inspection are di
scussed from the viewpoint of optical imaging theory. Object models fo
r 3-D wafer structures and faults were developed to realize test wafer
s and their imaging as a simulation tool. Coloured images are generate
d to analyse the colour properties of such structures and faults.