A. Wagner et al., FOCUSED ION-BEAM METROLOGY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(6), 1995, pp. 2629-2636
The measurement of resist image size using a finely focused ion beam (
FIB) is described. Comparisons of FIB and scanning electron microscope
(SEM) measurements of resist features are presented. The short penetr
ation range of an ion relative to an electron is shown to offer fundam
ental advantages for critical dimension metrology. Ion beams can induc
e less dimensional change (damage) than SEMs during the measurement pr
ocess, potentially yielding improved measurement precision. Resist cro
ss sectioning using FIB is demonstrated, and the factors contributing
to quality of the cross section are presented. An H2O gas assisted etc
hing process for polymer resists has been developed and is shown to si
gnificantly improve the quality of resist cross sections. (C) 1995 Ame
rican Vacuum Society.