Sm. Shank et al., FABRICATION OF HIGH-ASPECT-RATIO STRUCTURES FOR MICROCHANNEL PLATES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(6), 1995, pp. 2736-2740
Substrates for microchannel plates have been fabricated using Si micro
machining techniques. High aspect ratio pores are constructed using re
active ion etching and streaming electron cyclotron resonance etching,
and low-pressure chemical vapor deposition (LPCVD). In one process, 4
0 mu m deep pores with 2 mu m openings on 4 mu m centers are directly
etched in Si. Alternatively, pores with aspect ratios of 30:1 are cons
tructed in a low-stress SiNx membrane using a sacrificial template pro
cess whereby pillars of Si are etched and then subsequently backfilled
with a dielectric using LPCVD. (C) 1995 American Vacuum Society.