Deposition and patterning processes to produce 9x9 mu m ferroelectric
capacitor (FECAP) structures, and the back-end processes necessary to
integrate them with silicon-on-sapphire (SOS) circuits have been devel
oped with the aim of demonstrating a 4kbit non-volatile RAM (NVRAM) on
SOS. PZT thin film deposition by a sol-gel route has been characteris
ed and dielectric, ferroelectric and fatigue measurements taken.