Aa. Krasnoperova et al., EFFECT OF LOW-SOLUBILITY SURFACE-LAYER ON DEVELOPMENT OF AZ-PF514, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 11(6), 1993, pp. 2829-2833
Effect of prebake conditions on dissolution of Hoechst AG positive che
mically amplified resist AZ-PF514 has been studied. It was shown that
the dissolution of the resist was nonlinear, with the retardation time
strongly dependent on prebake conditions. Plasma etching of the top l
ayer of the resist has been proposed in order to eliminate undesirably
long development retardation time of the high temperature baked resis
t. It was shown that the roughness of the developing resist film was c
aused by the surface layer of low solubility.