M. Sauter et al., APPLICATION OF ELECTRON-BEAM LITHOGRAPHY FOR DOWNSCALING OF SOI-BIPOLAR AND BICMOS, Microelectronic engineering, 30(1-4), 1996, pp. 31-34
A direct-write sub-100-nm electron beam lithography has been used for
scaling of a novel lateral bipolar structure. The keyprocess is a lith
ographic base definition by using small PMMA structures as implantatio
n masks. Downscaling of base widths into the sub-100-nm-regime could b
e successfully demonstrated. Process simulation is used to estimate th
e effects of process parameters on device scaling. The physical and te
chnological effects which are responsible for base formation are inten
sively discussed. A relation for base formation is derived and confirm
ed by electrical measurements.