Cm. Reeves et al., FABRICATION OF 200NM FIELD-EFFECT TRANSISTORS BY X-RAY-LITHOGRAPHY USING A LASER-PLASMA X-RAY SOURCE, Microelectronic engineering, 30(1-4), 1996, pp. 187-190
The laser-plasma X-ray source at the Rutherford Appleton Laboratory ha
s been used in a series of preliminary lithography trials in order to
establish the feasibility of using this source for deep submicron devi
ce fabrication. These trials have provided a demonstration of photores
ist linewidths down to 130nm and functional silicon FETs have been pro
duced with 200nm gate electrodes. These devices show peak transconduct
ances of 220mS/mm and 100mS/mm for n-channel and p-channel cases respe
ctively. This paper summarises the lithographic procedures and resulti
ng device characteristics.