FABRICATION OF 200NM FIELD-EFFECT TRANSISTORS BY X-RAY-LITHOGRAPHY USING A LASER-PLASMA X-RAY SOURCE

Citation
Cm. Reeves et al., FABRICATION OF 200NM FIELD-EFFECT TRANSISTORS BY X-RAY-LITHOGRAPHY USING A LASER-PLASMA X-RAY SOURCE, Microelectronic engineering, 30(1-4), 1996, pp. 187-190
Citations number
3
Categorie Soggetti
Optics,"Physics, Applied","Engineering, Eletrical & Electronic
Journal title
ISSN journal
01679317
Volume
30
Issue
1-4
Year of publication
1996
Pages
187 - 190
Database
ISI
SICI code
0167-9317(1996)30:1-4<187:FO2FTB>2.0.ZU;2-Y
Abstract
The laser-plasma X-ray source at the Rutherford Appleton Laboratory ha s been used in a series of preliminary lithography trials in order to establish the feasibility of using this source for deep submicron devi ce fabrication. These trials have provided a demonstration of photores ist linewidths down to 130nm and functional silicon FETs have been pro duced with 200nm gate electrodes. These devices show peak transconduct ances of 220mS/mm and 100mS/mm for n-channel and p-channel cases respe ctively. This paper summarises the lithographic procedures and resulti ng device characteristics.