Sub-0.25 mu m technology may require gap settings as small as 10 mu m
Consequently, it is of the utmost importance to fabricate masks which
do not have large curvature towards the device wafer. In this work, fi
nite element methods are used to predict the out-of-plane shape of the
mask blank throughout the fabrication process in order to predict and
correct bow (out-of-plane distortion) of mask blanks.