This paper investigates the thermal process conditions of the Bottom A
nti-Reflective Layer for i-Line lithography (BARLi) using various char
acterization techniques such as TGA and WCM (Tg). The thermal modifica
tions of the material are related to the variations in its functional
properties, namely degree of solubility, absorption, thickness and ref
lectivity. A thermal process window is defined to obtain a maximum imp
rovement from this technology.