Va. Kudryashov et al., ELECTRON-BEAM LITHOGRAPHY USING CHEMICALLY-AMPLIFIED RESIST - RESOLUTION AND PROFILE CONTROL, Microelectronic engineering, 30(1-4), 1996, pp. 305-308
The effect of post exposure bake and softbake conditions on the sensit
ivity of AZPN114 has been investigated experimentally. A bilayer syste
m for undercut structures has been achieved using two layers of AZPN11
4 with different softbake temperatures. A single layer of AZPN114 has
also been used to produce undercut and tailored resist profiles by two
different multiple exposure strategies at different beam energies.