One-level gray-tone lithography, in spite of using common mask techniq
ue and CMOS equipment, has quite different demands on data preparation
and wafer processing. This paper reports on algorithms to transfer an
initial height profile H-i(x,y) into a design representation shape nr
(x,y) in the common data format GDSII, which could be used directly by
a commercial mask shop. The great data amount of a reticle layout has
been reduced significantly by a first order data compaction. The poss
ibly nonlinear influences of the different process steps on the transf
er function have been regarded. The specific parameters for the mask m
aking and the resist process are determined. In the field of resist pa
ttern transfer into a substrate material, a silicon etching process wa
s evaluated.