Two new methods have been proposed to optimize the focused ion beam (F
IB) technique for repair of phase shift masks (PSMs). The alternating
box method is used to eliminate the post FIB repair phase trench defec
t and the biased method to eliminate the gallium staining effect. Both
methods require only a change of sputtering or beam scanning strategy
. Rim, halftone and embedded PSMs for contact hole and poly line featu
res with programmed defects have been fabricated and repaired by the n
ew methods. computer simulation and experimental photolithography have
confirmed that opaque defects can be repaired by the optimized FIB te
chnique without leaving any post repair ''ghost'' defects.