The central problem of the sensor design is a good thermal insulation
of the P(VDF/TrFE) thin film from the read-out circuit. Two variations
were examined - thin carrier membranes of SiO2/Si3N4 produced through
back etching and thick thermal insulating layers out of spin-coated p
olymers with via holes. Through simulation and measurements on single
element sensors and linear arrays for both variants an optimal design
could be established. Membrane sensors consisting of 1 mu m P(VDF/TrFE
) thin film deposited on a 0.65 mu m thick membrane show within the fr
equency range of 10 Hz to 1 kHz comparatively higher values for respon
sivity and specific detectivity than insulating layer sensors. The ins
ulating layer sensors have in the most favourable case a thermal cutof
f frequency of about 100 Hz, below that the responsivity remains const
ant while the specific detectivity and NEP deteriorate again. The opti
mal layer thickness for the compound of BCB and P(VDF/TrFE) for a chop
per frequency of about 100 Hz is at approximately 18...25 mu m. The ad
vantages of the design with insulating layer are however, that a filli
ng factor of almost 100 % independently of the pixel size is reachable
and that very small pixels of about (50x50) mu m(2) are realisable to
o.