Vl. Falko et al., SURFACE THERMOPLASMA WAVES AND THEIR INTERACTION WITH FLOW OF CHARGED-PARTICLES AT A SEMICONDUCTOR-METAL INTERFACE, Solid-state electronics, 39(4), 1996, pp. 611-614
It is shown that slow surface thermoplasma waves exist at an interface
of a semiconductor with an ideal metal if thermal motion of conductio
n electrons causes the spatial dispersion of the dielectric permeabili
ty in the semiconductor. The spectrum and the damping of these waves a
re obtained. The collisionless damping is due to the interaction of th
e surface thermoplasma waves with the conduction electrons which move
along a normal to the boundary without collisions through the region o
f the surface wave localization. The Landau damping is exponentially s
mall in comparison with the damping. Amplification of the surface ther
moplasma wave can be realized by using a flow of charged particles inj
ected into the semiconductor from the metal.