One of the technical trends for a-Si TFTs is their application to larg
e-size, high-pixel-density AM-LCDs such as XGA, EWS and HDTV. For thes
e applications, the TFT performance must be improved and production th
roughput must be increased to reduce the cost of manufacturing. We wil
l discuss four technologies which will be most important for these pur
poses. They are: (1) fully self-aligned TFT technology, (1) non-mass-s
eparated ion-doping technology; (3) aluminum-gate-line process technol
ogy; and (4) high-deposition-rate a-Si technology. All of them are als
o suitable for current AM-LCDs such as VGA displays. These technologie
s are expected to improve TFT device characteristics as well as increa
se production throughput.