M. Pasandidehfard et J. Mostaghimi, ON THE SPREADING AND SOLIDIFICATION OF MOLTEN PARTICLES IN A PLASMA SPRAY PROCESS - EFFECT OF THERMAL CONTACT RESISTANCE, Plasma chemistry and plasma processing, 16(1), 1996, pp. 83-98
The spreading and simultaneous solidification of a liquid droplet upon
its impingement onto a substrate permitting thermal contact resistanc
e has been numerically simulated; the effect of contact resistance and
the importance of solidification on droplet spreading are investigate
d. The numerical solution for the complete Navier-Stokes equations is
based on the modified SOLA-VOF method using rectangular mesh in axisym
metric geometry. The solidification of the deforming droplet is consid
ered by a one-dimensional heat conduction model. The predictions are i
n good agreement with the available experimental data and the model ma
y be well suited for investigating droplet impact and simultaneous sol
idification permitting contact resistance at the substrate. We found t
hat the final splat diameter could be extremely sensitive to the magni
tude of the thermal contact resistance. The results also show that for
the condition of higher Reynolds and/or higher Stefan numbers the eff
ect of solidification on the final splat diameter is more important.