A simple, efficient and accurate technique for the determination of th
e drain resistance of LDD MOSFETs, using a two-dimensional device simu
lator, is presented. This method does not require the artificial intro
duction of constraints that would alter the normal operating condition
s and geometry of the device. Comparison is made with a more elaborate
technique, where the drain region is modelled as a network of resista
nces. For an appropriately chosen mesh size, good agreement to within
10% has been achieved for the two techniques. In terms of computationa
l labour, the simple technique enjoys at least an order of magnitude a
dvantage compared with the more elaborate model. The two techniques ha
ve also been used to study the dependence of the drain resistance on t
he gate and the drain bias, and to establish the accuracy over a broad
bias range. An estimate is also made of the degradation of the drain
resistance due to hot-carrier stress.