I. Heyvaert et al., COMPARATIVE-STUDY OF THE INTERFACE ROUGHNESS OF AG AU AND CU/AU MULTILAYERS WITH SCANNING-TUNNELING-MICROSCOPY AND X-RAY-DIFFRACTION/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(2), 1996, pp. 1121-1125
The interface roughness is a very important parameter determining the
performances of multilayered structures. Ag/Au and Cu/Au textured mult
ilayers have been produced by thermal evaporation in an ultrahigh vacu
um chamber. After deposition of the Au, Ag, or Cu layer, the surface r
oughness at different sampling lengths was probed in situ by scanning
tunneling microscopy. After completion of the multilayers, the samples
were taken from the ultrahigh vacuum chamber and measured in an x-ray
-diffraction unit. Low-angle as well as high-angle specular x-ray-diff
raction curves were analyzed using a refinement program which takes in
to account layer thickness fluctuations, interface roughness, and crys
talline disorder. The average interface roughness, obtained from fitti
ng the x-ray-diffraction profiles, is then compared to the roughness o
f the film growth front, which was probed with the scanning tunneling
microscope. The roughness obtained from the x-ray-diffraction profiles
corresponds to a lateral sampling scale which is in good agreement wi
th the average grain size within the layers, indicating that x rays sc
atter coherently over a volume which is relatively small. Our work als
o shows the complementarity of the scanning tunneling microscopy and x
-ray-diffraction technique to probe interface roughness of multilayers
. (C) 1996 American Vacuum Society.