KELVIN PROBE FORCE MICROSCOPY FOR CHARACTERIZATION OF SEMICONDUCTOR-DEVICES AND PROCESSES

Citation
M. Tanimoto et O. Vatel, KELVIN PROBE FORCE MICROSCOPY FOR CHARACTERIZATION OF SEMICONDUCTOR-DEVICES AND PROCESSES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(2), 1996, pp. 1547-1551
Citations number
16
Categorie Soggetti
Physics, Applied
ISSN journal
10711023
Volume
14
Issue
2
Year of publication
1996
Pages
1547 - 1551
Database
ISI
SICI code
1071-1023(1996)14:2<1547:KPFMFC>2.0.ZU;2-4
Abstract
Kelvin probe force microscopy was applied to the characterization of A l0.3Ga0.7As/GaAs multilayer structures and Si-pn structures. The spati al resolution of Kelvin probe force microscopy measurement was investi gated using cleaved Al0.3Ga0.7/As/GaAs structures. A 40-nm-thick Al0.3 Ga0.7As layer was resolved with potential difference of 15 mV. It was found that the measured potential is sensitive to the Al mole fraction for AlGaAs. Two-dimensional delineation of Si-pn structures was succe ssfully carried out on the topmost and the cleaved surfaces. A decreas e of a depletion-layer width with increasing the intensity of light il luminating the sample was observed. It was confirmed through investiga ting illumination effects on various kinds of structures that the meas ured Kelvin probe force microscopy potential reflects the surface band structure of the sample. A lateral impurity profile under the ion imp lantation mask was extracted from the two-dimensional potential image obtained on the cleaved pn junction by calibrating with the impurity c oncentration profile measured by the spreading resistance method. (C) 1996 American Vacuum Society.