LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS

Authors
BLECH IA WOOD P
Citation
Ia. Blech et P. Wood, LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 11(3), 1993, pp. 728-729
Citations number
5
Categorie Soggetti
Physics, Applied
Journal title
Journal of vacuum science & technology. A. Vacuum, surfaces, and films → ACNP
ISSN journal
07342101
Volume
11
Issue
3
Year of publication
1993
Pages
728 - 729
Database
ISI
SICI code
0734-2101(1993)11:3<728:LTCABE>2.0.ZU;2-3
Abstract
Diamondlike carbon films were deposited on silicon, gallium arsenide a nd aluminum substrates using ion-assisted chemical vapor deposition. T he stress of these films was measured as a function of temperature bet ween 25 and 150-degrees-C. Using the stress-temperature measurements, the average linear thermal expansion coefficient was found to be 2.3 p pm/degrees-C, while the biaxial elastic modulus 1.74 X 10(11) Pa.