Ia. Blech et P. Wood, LINEAR THERMAL-EXPANSION COEFFICIENT AND BIAXIAL ELASTIC-MODULUS OF DIAMOND-LIKE CARBON-FILMS, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 11(3), 1993, pp. 728-729
Diamondlike carbon films were deposited on silicon, gallium arsenide a
nd aluminum substrates using ion-assisted chemical vapor deposition. T
he stress of these films was measured as a function of temperature bet
ween 25 and 150-degrees-C. Using the stress-temperature measurements,
the average linear thermal expansion coefficient was found to be 2.3 p
pm/degrees-C, while the biaxial elastic modulus 1.74 X 10(11) Pa.