FABRICATION OF SI NANOSTRUCTURES BY CONTROLLED SIDEWALL OXIDATION

Citation
Ph. Beton et al., FABRICATION OF SI NANOSTRUCTURES BY CONTROLLED SIDEWALL OXIDATION, Solid-state electronics, 40(1-8), 1996, pp. 265-269
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
00381101
Volume
40
Issue
1-8
Year of publication
1996
Pages
265 - 269
Database
ISI
SICI code
0038-1101(1996)40:1-8<265:FOSNBC>2.0.ZU;2-0
Abstract
We have fabricated Si dots and wires with widths as small as 2 nm by t hermally oxidizing an etched mesa in a controlled manner. Electrical c ontacts are deposited on the Si nanostructures so that their current-v oltage characteristics may be measured. For dots fabricated from wafer s with a n-i-n doping profile we observe a linear dependence of the ro om temperature conductance on the device diameter, which we explain in terms of the profile of the Si/SiO2 interface. We are able to extract the width of the unoxidized Si from this dependence and find that the I(V) of devices with active widths less than 10 nm measured at 77 K i s non-linear. I(V) measurements are also presented for bar shaped devi ces fabricated from pn material which clearly show that rectification occurs, even for active widths less than 10 nm.