B. Dietrich et al., STRAIN-MEASUREMENT IN THIN PSEUDOMORPHIC SIGE LAYERS OF SUBMICRON WIRES USING RAMAN-SPECTROSCOPY, Solid-state electronics, 40(1-8), 1996, pp. 307-310
The internal strain in thin heteroepitaxial Si1-xGex layers was invest
igated before and after etching the material between the remaining nar
row stripes. The strong inner stress in pseudomorphic heterostructures
, caused by the difference in the lattice constants of Si and Si1-xGex
, relaxes in small regions after removing the surrounding layer materi
al which mediates the stress. Strain and relaxation were determined fr
om micro-Raman measurements. These measurements were compared with cal
culations using a two-dimensional finite element program to predict th
e strain distributions in Si1-xGex layers. Assuming a pure elastic rel
axation of the pseudomorphic strain we have found a reasonably good ag
reement between the measured and calculated Raman shifts.