STRAIN-MEASUREMENT IN THIN PSEUDOMORPHIC SIGE LAYERS OF SUBMICRON WIRES USING RAMAN-SPECTROSCOPY

Citation
B. Dietrich et al., STRAIN-MEASUREMENT IN THIN PSEUDOMORPHIC SIGE LAYERS OF SUBMICRON WIRES USING RAMAN-SPECTROSCOPY, Solid-state electronics, 40(1-8), 1996, pp. 307-310
Citations number
13
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
00381101
Volume
40
Issue
1-8
Year of publication
1996
Pages
307 - 310
Database
ISI
SICI code
0038-1101(1996)40:1-8<307:SITPSL>2.0.ZU;2-6
Abstract
The internal strain in thin heteroepitaxial Si1-xGex layers was invest igated before and after etching the material between the remaining nar row stripes. The strong inner stress in pseudomorphic heterostructures , caused by the difference in the lattice constants of Si and Si1-xGex , relaxes in small regions after removing the surrounding layer materi al which mediates the stress. Strain and relaxation were determined fr om micro-Raman measurements. These measurements were compared with cal culations using a two-dimensional finite element program to predict th e strain distributions in Si1-xGex layers. Assuming a pure elastic rel axation of the pseudomorphic strain we have found a reasonably good ag reement between the measured and calculated Raman shifts.