Jq. Sun et al., A NOVEL VACUUM PROCESS FOR OH ADDITION TO POLYSTYRENE, POLYETHYLENE, AND TEFLON(TM), Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 14(3), 1996, pp. 1382-1386
Citations number
18
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
A special vacuum process has been developed for adding an OH functiona
l group onto polymer surfaces with different reactivities. In this nov
el technique, polymer surfaces were exposed, in a vacuum chamber, to O
H radicals generated by the dissociation of water vapor on hot rhenium
wires. We found by x-ray photoelectron spectroscopy and high resoluti
on electron energy loss spectroscopy that about half a monolayer equiv
alent of C-OH groups could be generated on a relatively reactive polym
er like polystyrene with a 10 s exposure at a water pressure of 1x10(-
3) Torr. However, under the same experimental conditions, the oxygen i
ncorporation on more stable polymers was much lower; it was reduced by
90% on polyethylene and to practically zero on Teflon. For surface en
gineering of these stable polymers, thermionic electrons emitted from
the hot filaments were used to facilitate electron impact ionization o
f some of the water vapor. Positive ions from the ionization region we
re then extracted and accelerated by an electrostatic field toward the
polymer target which was separated from the ionization region by an a
djustable distance about twice the gas-phase collision mean-free path.
Although ion bombardment of the polymer surface was limited by the in
sulating property of the polymer, ion-molecule collisions in the gas p
hase were efficient with such a setup in generating energetic neutrals
flying toward the polymer surface for the activation of the polymer.
With an accelerating voltage of 50 V and a water pressure of 1 x 10(-3
) Torr (the collision mean-free path being about 5 cm), about a 0.2 mo
nolayer equivalent of COH was added to Teflon and polyethylene in 60 s
. (C) 1996 American Vacuum Society.