P. Gassmann et al., ELEMENTAL STEPS IN THE GROWTH OF ALN THIN-FILMS ON NIAL UPON THERMAL-DECOMPOSITION OF AMMONIA, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 14(3), 1996, pp. 813-818
Citations number
23
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Ammonia adsorption at T=80 K on NiAl(111) and NiAl(001)and subsequent
thermal decomposition at elevated temperatures leads to the formation
of aluminum nitride (AIN). After annealing to T=600 K, NH3 is dissocia
ted completely and atomic nitrogen is adsorbed on the surface. At temp
eratures between 800 and 1200 K, an intermediate ALN state is found. T
he formation process of AlN has finished after annealing to 1200 K. We
ll-ordered AN thin films on NiAl(001) and NiAl(111) can be prepared by
several cycles of ammonia adsorption at T=80 K and annealing to 1250
K. The films render a distinct low-energy electron diffraction pattern
with hexagonal (AlN/NiAl(111)) or pseudo-twelvefold (AlN/NiAl(001)) s
ymmetry. High resolution electron energy loss spectra of ordered AlN f
ilms show a Fuchs-Kliewer phonon mode at 865 cm(-1) in good agreement
with theoretical spectra on the base of the dielectric theory. The ele
ctronic gap of the thin AlN films is determined to be E(g) congruent t
o 6.1 eV. Gap states at 1.1 and 5.1 eV were found for AlN/NiAl(111) as
well as for AlN/NiAl(001). (C) 1995 American Vacuum Society.