ELEMENTAL STEPS IN THE GROWTH OF ALN THIN-FILMS ON NIAL UPON THERMAL-DECOMPOSITION OF AMMONIA

Citation
P. Gassmann et al., ELEMENTAL STEPS IN THE GROWTH OF ALN THIN-FILMS ON NIAL UPON THERMAL-DECOMPOSITION OF AMMONIA, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 14(3), 1996, pp. 813-818
Citations number
23
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
ISSN journal
07342101
Volume
14
Issue
3
Year of publication
1996
Part
1
Pages
813 - 818
Database
ISI
SICI code
0734-2101(1996)14:3<813:ESITGO>2.0.ZU;2-L
Abstract
Ammonia adsorption at T=80 K on NiAl(111) and NiAl(001)and subsequent thermal decomposition at elevated temperatures leads to the formation of aluminum nitride (AIN). After annealing to T=600 K, NH3 is dissocia ted completely and atomic nitrogen is adsorbed on the surface. At temp eratures between 800 and 1200 K, an intermediate ALN state is found. T he formation process of AlN has finished after annealing to 1200 K. We ll-ordered AN thin films on NiAl(001) and NiAl(111) can be prepared by several cycles of ammonia adsorption at T=80 K and annealing to 1250 K. The films render a distinct low-energy electron diffraction pattern with hexagonal (AlN/NiAl(111)) or pseudo-twelvefold (AlN/NiAl(001)) s ymmetry. High resolution electron energy loss spectra of ordered AlN f ilms show a Fuchs-Kliewer phonon mode at 865 cm(-1) in good agreement with theoretical spectra on the base of the dielectric theory. The ele ctronic gap of the thin AlN films is determined to be E(g) congruent t o 6.1 eV. Gap states at 1.1 and 5.1 eV were found for AlN/NiAl(111) as well as for AlN/NiAl(001). (C) 1995 American Vacuum Society.