E. Vincent et al., RELIABILITY ISSUES OF FURNACE NITRIDATED OXIDES PREPARED WITH REDUCEDTHERMAL BUDGET IN N2O AMBIENT, Solid-state electronics, 39(7), 1996, pp. 1051-1054
The purpose of this paper is to analyze the impact of the thermal budg
et on the quality of furnace nitridated SiO2 layers in N2O ambient. Af
ter comparing the quality of various oxynitride layers prepared with d
ifferent thermal budgets, it is shown that a short nitridation under h
igh temperature conditions provides an insulator of similar robustness
to that obtained after a lower temperature nitridation during a longe
r time. In addition, it will be shown that the quality of the finished
oxynitride layer is practically independent of the nature of the init
ial SiO2 film (i.e. dry or steam), and is only related to the quantity
of nitrogen present at the Si/SiO2 interface. Finally, it is suggeste
d that the preparation of a high efficiency, low thermal budget oxynit
ride layer is fully feasible, provided that the quantity of nitrogen i
ncorporated into the Si/SiO2 system has been properly adjusted. Copyri
ght (C) 1996 Elsevier Science Ltd.