RELIABILITY ISSUES OF FURNACE NITRIDATED OXIDES PREPARED WITH REDUCEDTHERMAL BUDGET IN N2O AMBIENT

Citation
E. Vincent et al., RELIABILITY ISSUES OF FURNACE NITRIDATED OXIDES PREPARED WITH REDUCEDTHERMAL BUDGET IN N2O AMBIENT, Solid-state electronics, 39(7), 1996, pp. 1051-1054
Citations number
14
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
00381101
Volume
39
Issue
7
Year of publication
1996
Pages
1051 - 1054
Database
ISI
SICI code
0038-1101(1996)39:7<1051:RIOFNO>2.0.ZU;2-C
Abstract
The purpose of this paper is to analyze the impact of the thermal budg et on the quality of furnace nitridated SiO2 layers in N2O ambient. Af ter comparing the quality of various oxynitride layers prepared with d ifferent thermal budgets, it is shown that a short nitridation under h igh temperature conditions provides an insulator of similar robustness to that obtained after a lower temperature nitridation during a longe r time. In addition, it will be shown that the quality of the finished oxynitride layer is practically independent of the nature of the init ial SiO2 film (i.e. dry or steam), and is only related to the quantity of nitrogen present at the Si/SiO2 interface. Finally, it is suggeste d that the preparation of a high efficiency, low thermal budget oxynit ride layer is fully feasible, provided that the quantity of nitrogen i ncorporated into the Si/SiO2 system has been properly adjusted. Copyri ght (C) 1996 Elsevier Science Ltd.