HEAT-TRANSFER IN COOLING SYSTEMS OF MICROELECTRONIC EQUIPMENT WITH PARTIALLY SUBMERGED CONDENSERS

The heat transfer in a liquid immersion cooling system for microelectr onic equipment was tested, The internal volume of the module was divid ed into two parts with a special partition. Inert dielectric liquid MD 3F was used in the experiments as a working hold. The proposed system can reduce the influence of noncondensable gas on heat transfer at the vapor space condenser, It was determined that the average heat transf er coefficient does not substantially decrease during the condensation of vapor on the partially submerged tubes; this is due to the effect of the surface-tension-driven pressure gradient which occurs in the fi lm of the condensate.